Powering the Future of Embedded Innovation

Powering the Future of Embedded Innovation

 

Powering the Future of Embedded Innovation

Discover how Tria Technologies and Intel® are redefining performance, scalability, and reliability for next-generation embedded and edge applications.

From industrial automation to robotics and medical devices, today’s embedded systems demand more performance in less space. As an Intel® Prestige Partner, Tria Technologies delivers one of the industry’s most comprehensive compute module portfolios—built to accelerate innovation at the edge.

In this brochure, you’ll explore Tria’s Intel®-powered solutions across COM-HPC®, COM Express® and SMARC® standards. Each platform is designed for scalability, rugged reliability, and seamless integration into automation, transportation, medical, and industrial systems.

Learn how Intel’s latest Core™, Xeon®, and Atom® processors, paired with Tria’s compact and efficient designs, enable real-time AI, machine vision, and high-throughput applications—pushing performance where it matters most.

Key Takeaways

  • Explore Tria’s complete Intel®-based compute module lineup
  • Compare form factors for performance, I/O, and power efficiency
  • Learn how Tria and Avnet streamline integration with global distribution and support
  • See real-world examples of embedded systems built for automation, robotics, and AI at the edge

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