Master Electronics Cooling: Structure Function Methods Demystified
Heat can be a silent killer in complex electronics. This in-depth primer unveils how structure functions—a revolutionary thermal analysis method—can reveal layer-by-layer thermal behavior within electronic systems. Discover how engineers are using Simcenter tools to optimize cooling, improve reliability, and eliminate costly guesswork in thermal modeling. Gain practical techniques that reduce prototype iterations, re-spins, and field failures.
Key Takeaways:
- Understand cumulative and differential structure functions to analyze heat flow in 3D systems.
- Identify delamination or interface degradation using Simcenter™ T3STER™ structure-function analysis.
- Improve thermal model accuracy through calibration and real-world transient testing.
- Reduce design risks in LEDs, laptops, and high-power electronics through advanced thermal insights
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